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SMTA International Conference on Soldering and Reliability Call for Papers

Jan 07, 2011

Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2011 International Conference on Soldering and Reliability being held this May 4-6, 2011 in Toronto, Ontario, Canada. Abstracts are due by January 28, 2011.

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference brings together a community of soldering and reliability experts.

Suggested topics to be covered include:

  • Lead-free Assembly and Test

  • Reliability

  • Harsh Environment

  • Tin Whiskers

  • New Alloys

  • Electromigration

  • Thermal dissipation

  • Environmental Compliance/Regulations

  • Conformal Coating

  • Manufacturing Process

  • Package on Package

  • Advanced Packaging

  • Halogen-Free Laminates

  • High Density Interconnects

  • Thermal Interface Materials

  • Underfill

  • Printed Electronics

  • Die Attach Soldering & L-F Challenges

If you would like to present at this conference, please upload a 200-300 word abstract online at the link below. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February, 2011. Technical papers are required and will be due on March 25, 2011.

The conference is sponsored by the SMTA Toronto Chapter.

For more information contact Patti Hvidhyld at 952-920-7682 begin_of_the_skype_highlighting              952-920-7682      end_of_the_skype_highlighting or or visit the Call for Papers online at

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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