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FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Jan 05, 2011

FINEPLACER® Lambda, Flip Chip Bonder.

FINEPLACER® Lambda, Flip Chip Bonder.

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring precision, advanced technologies and the highest bonding placement accuracy (down to ± 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging using various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, adhesives, and curing.

Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors, and more. The system handles component sizes from 0.15 to 60 mm and special tools allow object sizes down to 5 micron.

For more information, visit the company in Booth 2204 or visit http://www.finetechusa.com.

FINETECH is a leading manufacturer of innovative rework and advance packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

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