SMT, PCB Electronics Industry News

IPC Releases Revision A to IPC-2222 Design Standard

Dec 17, 2010

BANNOCKBURN, IL - IPC - Association Connecting Electronics Industries® has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

One of the biggest changes to the document is the addition of a listing of the positives and negatives of popular materials along with some of their performance characteristics. “Having the advantages and disadvantages of common laminates spelled out will help printed board designers select a suitable laminate material,” explains John Perry, IPC technical project manager. This information is provided in the form of a comparison table that also includes CTE (coefficient of thermal expansion) data, dielectric constant, and Tg.

Data on the relative cost of materials as well as their capabilities in terms of dimensional stability, material consistency and other special processing has also been added to this table. “We wanted to provide designers with guidance on laminate materials availability, relative cost, reworkability, moisture stability and suitability for lead-free applications,” says Perry.

Another new facet is the inclusion of data that provides guidance for the tolerances of printed board thickness, an area that hasn’t been addressed by the IPC document in many years. Helping designers address concerns about dimensional stability, the measurements are based on laminate to laminate thickness. The tolerances provided do not include any finishes or coatings and can help users avoid problems such as bowing or twisting.

Guidance on nonfunctioning lands, which can pose problems in multilayer boards, is now a part of IPC-2222A. “We provide a table that explains why you may want to keep or remove nonfunctioning lands,” Perry says. “For example, if a number of nonfunctioning lands are removed from a board with many layers, inner layers may separate during z-axis expansion, causing reliability concerns.”

The standard also examines supported and unsupported holes. Tolerances are provided for diameters of unsupported holes, such as those used to provide clearance for mounting hardware. There’s also a guide for the aspect ratio of holes. This latter section provides guidance on the ability to produce holes of specific diameters in relation to the thickness of the printed board. “Aspect ratio plays a key part in the ability of the printed board fabricator to provide sufficient plating along the barrel of a plated hole,” Perry said.

Designers who use IPC-2222A can help ensure that the boards they design will meet requirements when the boards are manufactured. “End boards usually have to meet the requirements of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. If a board is designed according to IPC-2222A specifications, the designer should have confidence that the board will meet IPC-6012 requirements,” Perry says.

IPC members may request a free single-user download of IPC-2222 by sending an e-mail to MemberTechRequests@ipc.org within 90 days of the document’s publication date. After that date, IPC members may purchase the standard for $36. The nonmember price is $72. For more information or to purchase IPC-2222A, visit http://www.ipc.org/2222.

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 18, 2017 -

Excel Electronics, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Sep 18, 2017 -

IPC Disappointed by Failure of Negotiated Rulemaking Aimed at Encouraging Recycling of Manufacturing Byproducts

Sep 12, 2017 -

IPC Joins Industry Coalition in Support of U.S. EPA in Litigation over Chemical Safety Act

Sep 11, 2017 -

IPC APEX EXPO 2018 Opening Keynote from Jared Cohen Will Highlight Technology’s Game Changers

Sep 07, 2017 -

Wage and Salary Survey Deadline for North American Electronics Assembly Industry Extended to September 29

Sep 07, 2017 -

IPC Praises Federal Court Decision to End Overtime Rule

Sep 06, 2017 -

Grupo Mirgor First Company in South America to Earn Certification as Qualified Manufacturer to IPC-J-STD-001/610 Recognized as IPC-Trusted Source and QML-Listed

Sep 03, 2017 -

North American PCB Orders Up, Sales Down, Raising Book-to-Bill Ratio

850 more news from Association Connecting Electronics Industries (IPC) »

Sep 25, 2017 -

Under what circumstances can a tantalum capacitor used instead of an aluminum electrolytic capacitor?

Sep 25, 2017 -

SMART Group and NPL Host Process, Design & Reliability Seminar

Sep 25, 2017 -

Most Technologically Advanced X-ray Cabinet from Scienscope at the Quality Show

Sep 25, 2017 -

Acculogic Offers Production Board Test Systems for the Automotive Industry

Sep 25, 2017 -

IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416

Sep 25, 2017 -

Gen3 Systems newly appointed Distributor for Nordson SELECT Selective Soldering Equipment

Sep 24, 2017 -

Europlacer Shows Printer at Productronica India – Just!

Sep 24, 2017 -

Microtronic GmbH Appoints Distributor for the LBT210 & ConTTest Systems in Spain and Portugal

Sep 24, 2017 -

INTERFLUX® Electronics Completes Testing on New Alloy at Ersa Demo Room

Sep 24, 2017 -

CyberOptics Launches Coordinate Measurement Software Suite for New High Speed SQ3000™ CMM System

See electronics manufacturing industry news »

IPC Releases Revision A to IPC-2222 Design Standard news release has been viewed 1842 times

Lead Free Wave Solder - 1 Click SMT

Universal GSM2 Feeders