SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from i3 Electronics


Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Dec 03, 2010

Adhesiveless, fil-based, liquid crystal polymer, high performance laminate.

Adhesiveless, fil-based, liquid crystal polymer, high performance laminate.

Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.

EI Combines Materials, Fabrication and Test Expertise to Deliver LCP Laminates with Exceptional Performance and Proven Reliability

Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Development and testing of Z-interconnect cross-sections for > 8 layer offerings are also underway.

Long known for its expertise and know-how in the fabrication and testing of high performance materials, EI’s innovative, adhesiveless, film-based LCP Laminates provide high density interconnection with proven reliability and performance. Beginning with Rogers ULTRALAM® 3000 series materials, EI fabricates, tests and assembles its LCP Laminates into advanced microelectronic packages including flex and chip-on-flex, offering a complete solution from design through test of the product.

"EI is committed to developing new processes, technologies and techniques that enable progress in the electronics industry. We fabricate LCP products and perform reliability testing of the structures we create, assisting our customers with the design ground rules of this technology," stated Voya Markovich, Sr. VP of R&D and CTO at EI. "Our test results have been excellent, allowing EI to supply complete solutions with proven reliability," he continued.

Applications and Markets

The low dielectric constant and low dissipation factor of LCP provide superior electrical performance across a wide range of the RF spectrum and it remains stable even under harsh environmental conditions such as extreme temperature and humidity. Couple that with tolerance to high levels of radiation exposure and LCP becomes an excellent solution for Aerospace & Defense applications such as microwave and digital circuits for communications and radar, satellites, munitions and avionics. Because it is biocompatible for use in the human body and near-hermetic due to low moisture absorption, LCP is also attractive for Medical applications such as implantable devices. When designs require the advantages of size, weight and power (SWaP) reduction and flexibility, EI LCP Laminates provide an excellent cost/performance ratio for users looking to make the jump from ceramic packages to an organic solution or any application requiring a system-in-package (SiP) approach.

For more information on EI LCP Laminates, contact Endicott Interconnect Technologies, 1093 Clark Street, Endicott, New York 1360. Tel: 1-866-820-4820, Fax: 607-755-7000, or visit our website at http://www.endicottinterconnect.com.

You must be a registered user to talk back to us.

More News from i3 Electronics

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

(16) more news from i3 Electronics

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering news release has been viewed 2814 times

Boundary Scan

PCB Cleaning