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Christopher Associates Debuts S3X-BF70M and 200N Series Wafer Bumping Pastes

Dec 01, 2010

Christopher Associates introduces the S3X-BF70M and 200N series wafer bumping pastes. The pastes exhibit a high definition over time and at elevated temperatures.

There are many ways to form solder deposits on wafers. Printing solder paste and reflowing into an array of bumps is both quick and easy. Approximately six percent of the total market is formed this way; however, 70 percent of the short runs and prototypes are candidates for stenciling solder paste to form the array of bumps. S3X-BF70M and S3X-BF200N series wafer bumping paste is the standard in wafer bumping processes throughout most companies in Asia.

For ordinary 250 μm bump sizes, the S3X-BF70M series is ideal. The paste offers superior cleaning performance in a SAC305 powder with a 20~38 μm diameter. For super fine 100 μm bump sizes, Christopher offers the S3X-BF200M series with a SAC305 powder and 5~20 μm diameter.

For further information, visit http://www.christopherweb.com

Apr 10, 2012 -

Christopher Associates to Exhibit the MAGNUS HD TREND at the SMTA Toronto Expo & Tech Forum

Apr 02, 2012 -

Christopher Associates to Exhibit the MAGNUS HD TREND at the Del Mar Show

Mar 16, 2012 -

See Christopher Associates’ Award-Winning MAGNUS HD TREND at IMAPS New England

Mar 13, 2012 -

Christopher Associates Has the Golden Ticket! Gives “Advertising Grants” at IPC APEX 2012

Mar 05, 2012 -

Christopher Associates Accepts 2012 NPI Award for the MAGNUS HD TREND from Tagarno

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Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO

Feb 03, 2012 -

Christopher Associates to Display High-Magnification Tagarno Magnus HD Trend at Both SMTA Dallas and Houston 2012

Jan 30, 2012 -

Christopher Associates' Jasbir Bath to Moderate Solder Joint Testing and Performance Meeting at IPC APEX 2012

Jan 26, 2012 -

Christopher Associates' Jasbir Bath to Present on Lead-free Alloys at IPC APEX 2012

Jan 21, 2012 -

Christopher Associates to Unveil New SPI Unit at the 2012 IPC APEX Expo

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