SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Package Converters Enable Testing Generation I product on Generation II System

Package Converters Enable Testing Generation I product on Generation II System

Nov 30, 2010

BGA Package Converter speeds system board development.

BGA Package Converter speeds system board development.

BURNSVILLE, MN - Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods. If the BGA device also has same solder ball composition, they can be soldered simultaneously using same reflow profile along with package converter.

1.27mm pitch, 256 pin BGA old generation product can be tested on new generation PCB which has 256BGA pattern with 1mm pitch until Silicon arrival

The Ironwood Electronics package converter PC-BGA256B/BGA256E-B-01 consists of multi layer PCB with a SAC305 solder ball for SMT processing. The solder balls and PCB are RoHS compliant. Pin mapping from top to bottom footprint is 1:1. PC-BGA256B/BGA256E-B-01 is designed to receive 23x23mmBGA, 16x16 array, 1.27mm pitch on the top and converts 1:1 pin mapping to 17x17mmBGA, 16x16 array, 1mm pitch on the bottom. This allows new development system board to be tested with previous version of BGA device until the arrival of new silicon (1mm pitch BGA). This pitch convertor can be reversed by removing solder balls from 1mm pitch side and adding them on 1.27mm pitch side. By doing this, customer can test new generation BGA device (1mm pitch) on old generation system board (1.27mm pitch) for isolating new device related issues.

Pricing for the PC-BGA256B/BGA256E-B-01 is $315.00 at qty 1 with reduced pricing available depending on quantity required.

Apr 06, 2011 -

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Mar 22, 2011 -

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Mar 11, 2011 -

Elastomer Socket for Infineon's BGA221

Feb 26, 2011 -

GHz Bandwidth Socket for Dual WLCSP

Feb 14, 2011 -

Prototype and Debug 96 ball BGA with Ease

Feb 03, 2011 -

Stamped Spring Pin BGA Socket for Burn-in Characterization

Jan 12, 2011 -

ATE Spring Pin BGA Socket for Digital Camera Processor

Dec 10, 2010 -

Spring Pin Socket for Kelvin Resistance Measurement

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

Package Converters Enable Testing Generation I product on Generation II System news release has been viewed 1027 times

  • SMTnet
  • »
  • Industry News
  • »
  • Package Converters Enable Testing Generation I product on Generation II System
Non-heated dispensing system

Plasma Prior to Conformal Coating