SMT, PCB Electronics Industry News

Universal’s APL Attends Regional and National Technology Events

Nov 04, 2010

Universal Instruments’ Advanced Process Laboratory (APL) highlighted its Failure Analysis and Prototyping capabilities at recent regional SMTA shows, including the LI Chapter on October 13 and the Empire Chapter on October 19.

Universal representatives were on hand to discuss the lab’s advanced capabilities as well as offering specific presentations on Failure Analysis, 01005 Assembly, and Circuit Board Pad Cratering. The APL will also be displaying at IMAPS 2010 – the 43rd International Symposium on Microelectronics – on November 2-4.

The regional shows provided an opportunity to discuss market-specific challenges with local OEMs, vendors, and manufacturers. George Westby, Director of Universal’s Advanced Process Lab, commented, "We’re excited to discuss the unique concerns of this local electronics community and contribute valuable knowledge to help them achieve the best possible results in all of their processes.” Westby continued, “Whether they want to refine the products they build today, seamlessly develop and integrate a new product, or prepare for future products and processes, we deliver competitive advantage.”

The Long Island and Empire Chapter SMTA regional shows featured presentations including: “Topic Expert Failure Analysis: Methods and Solutions” and “01005 Assembly Process, Materials and Tooling”. Universal’s APL maintains a commitment to the SMTA with one current lab members currently acting as the VP of the SMTA Empire Chapter and another on the Board of Directors for the SMTA organization. The APL also maintains a high level of involvement with local non-profits organizations and an industry leader.

The national IMAPS 2010 show will allow the APL to interact with manufacturers in the Semiconductor market, where the group has had a lasting influence over the years through its Process Support and AREA Research Consortium.

Topics of research and development within these forums have included; System-in-Package (SiP), wafer fabrication, bump design, intermetallic studies, component manufacturing, over-molding, encapsulation, wafer bumping, and a wide range of other subjects. Universal has applied this knowledge and expertise in the development of its Genesis SC semiconductor placement platform, delivering high-accuracy semiconductor performance at surface mount speeds.

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, with offices in Europe, Asia, and the Americas.

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