SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Teradyne


Unisem Selects Teradyne ETS-88 for Analog and Power Management Test

Nov 03, 2010

ETS-88™ Test System.

ETS-88™ Test System.

NORTH READING, MA - Teradyne, Inc. (NYSE: TER) announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics. Unisem, a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies, will install the systems in their Silicon Valley Development Plant located in Sunnyvale, CA as well their production facilities in Asia.

“Unisem is one of the largest subcons for analog and power and we are pleased to add them to the growing installed base of the ETS-88”

“The ETS-88 is a good match for our analog, automotive and power management analog customers,” said C.H. Ang, Unisem Group COO. “By running up to four test programs simultaneously using multiple handlers and/or probers, the system advances the test coverage and capabilities we can provide on our test floor and correlates to lower cost of test for our customers.”

“Unisem is one of the largest subcons for analog and power and we are pleased to add them to the growing installed base of the ETS-88,” said David Anderson, business development manager for Teradyne’s Eagle Test business unit. “The addition of the ETS-88 to their test floor will provide cost-conscious customers a path to increase test coverage and accuracy with unprecedented throughput.”

Unisem will host an Open House at its Sunnyvale location on Friday, November 5th from 10 a.m. to 3 p.m PT. A demo and overview of the ETS-88 is scheduled for 1:30-3:00 p.m. PT.

For more information on the ETS-88, named Test & Measurement World’s 2010 Best in Test, visit http://www.eagletest.com/eagle_solutions/88.html

Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. With approximately 9,500 employees worldwide, Unisem has factory locations in Ipoh, Malaysia; Wales, United Kingdom; Chengdu, People’s Republic of China; Batam, Indonesia and Sunnyvale, USA. The company is headquartered in Kuala Lumpur, Malaysia. For more information about the company, its products and services, please visit its website at http://www.unisemgroup.com.

Celebrating its 50th anniversary in 2010, Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2009, Teradyne had sales of $819 million and currently employs about 3,000 people worldwide. For more information, visit http://www.teradyne.com. Teradyne (R) is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).

You must be a registered user to talk back to us.

More News from Teradyne

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 -

Registration Opens for 2015 Teradyne Users Group Conference

(19) more news from Teradyne

Unisem Selects Teradyne ETS-88 for Analog and Power Management Test news release has been viewed 3069 times

Lead Free Wave Solder - 1 Click SMT

ii-feed SMD Intelligent Feeder