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Christopher Associates Debuts New Printable No-Clean Pastes from Koki to the US

Nov 02, 2010

Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing. S3X48-M500 and S3X48-M500C are general use SAC305 lead-free solder pastes that are packaged in jars or cartridges, and are ideal for both large and small manufacturers.

S3X48-M500C is a modified version of M500, designed for improved heat resistance and better wetting with NiPd components. Nickel solderability is particularly useful in cheaper components with incomplete plating and in older components with oxidation issues.

Koki solder pastes feature excellent small feature printability and have a wide reflow processing window, making them easy to use. Additionally, the soldered joints are both shiny and well formed. The pastes were designed for use in Asian manufacturing environments, and exhibit a high level of refinement and consistency with minimal residue.

Additional features of both pastes include:

  • Wets well on all boards including OSP, NiAu, Sn, HASL(SAC305)

  • Halogen-free

  • Retains flux activation in longer reflow profiles

  • Widely accepted globally (well researched and stable)

  • Few to no voids

  • Resists head-in-pillow defects

For further information, visit http://www.christopherweb.com

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