Oct 26, 2010 
NC676 features best-in-class solder spread and wetting, print volume consistency down to 12 mm circles, and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. The no-clean paste leaves a colorless residue that is penetrable, maximizing pin testability.
The no-clean paste offers excellent resistance to hot and cold slump, resulting in minimal bridging and excellent wetting characteristics on all pad finishes. The use of NC676 results in clear, minimal residue, bright, shiny tin/lead solder joints and excellent solder spread on all common pad finishes.
NC676 provides excellent post-reflow yields and best in class after exposure to extreme humidity conditions. It also features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as excellent response to one-hour pause, after two knead strokes at 35-65 percent RH.
For more information about FCT Assembly’s NC676 no-clean paste, visit http://www.fctassembly.com.
FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil, and A-Laser. With numerous facilities in the United States, we are one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils, and precision cut parts.
At FCT Assembly, we set ourselves apart from our competitors by continuously studying new products and processes in order to uphold our reputation as a leader in technology. Our customers can always count on FCT Assembly to use the latest technology and to supply products with the highest quality.
For more information, visit http://www.fctassembly.com.
