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News from TRI - Test Research, Inc.


Test Research Inc. Highlights World’s Fastest 3D Solder Paste Inspection Test System at SMTA International Electronics Exhibition 2010

Oct 22, 2010

Test Research, Inc's World's Fastest 3D SPI TR7007

Test Research, Inc's World's Fastest 3D SPI TR7007

Taipei, Taiwan – Test Research Inc. (TRI, TAIEX 3030) announced today that the world’s fastest 3D Solder Paste Inspection test system, its TR7007 will be featured at the SMTA International Electronics Exhibition 2010 to be held in Orlando, Florida at the Walt Disney World Swan and Dolphin Resort from Oct. 26-27, 2010. TRI will also display a range of feature-rich test systems for printed circuit board assemblies (PCBAs) at TRI's booth 538.

The TR7007 is the world’s fastest SPI solution featuring ultra-high speed, shadow free optical inspection of 171cm2/sec at a 14um resolution using fringe pattern technology. It is equipped with a linear motor and linear scale DSP that provides a highly accurate X-Y table system. Additionally, its 2D / 3D virtual reality perspective provides a user-friendly defect review.

"This is our first time attending the SMTA International Electronics Exhibition event and we look forward to show off our latest new 3D Solder Paste Inspection model TR7007," said Jim Lin, TRI's Vice President for Global Sales and Marketing. "With this system, TRI now provides quality at the start of the SMT process that came from improving the quality of solder paste printing. Our test system expertise now is ideal for both small and high-density products due to enhancement in the product's quality.”

Also being shown at TRI's booth will be an offline version of an automated X-ray inspection system (AXI) TR7600, and the TR7500DT an automated optical inspection (AOI) desktop system. The TR7600 provides in-line inspection on double sided boards with the strength of effectively testing“hidden joints”such as those on Flip Chips, LGAs, and BGAs. The Tester can support the inspection of micro-components down to 0201 and 01005. The simplified User Interface and its Model and Package Libraries enable the User to quickly develop AXI programs in a matter of hours. The Repair Station displays “Golden” images to facilitate in the disposition of defects and it also provides “angle views” of joints, providing more information to the Operator on the defect, such as “barrel fill” on PTH devices.

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Oct 22, 2010 -

Test Research Inc. Highlights World’s Fastest 3D Solder Paste Inspection Test System at SMTA International Electronics Exhibition 2010

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