The SAM-CT23Q is the ideal solution for stress-free depanelization, providing a fixture-based highly efficient dust vacuum system. The compact system uses a 40,000 rpm spindle to separate PCBs from panels.
The router provides clean, precise depanelization for densely populated PCBs at a minimal cost. The tabletop model offers two methods of programming cutting paths: a teach pendant or the offline software program.
The software allows creation and editing of both position and program data as well as reading of PCB drawing data (DXF files). Offline programming also can save and read files containing data that was created using the program. As an additional benefit, files can be sent, received and edited when a PC is connected to the SAM-CT23Q router.
For more information about the SAM-CT23Q router or other Sayaka models, visit http://www.seikausa.com/products/sayaka/.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.