Upsets within the manufacturing process compounded with field reliability issues require boards to be reworked. Solder paste printing technologies are firmly established, but still contribute more than 60 percent of the total process defects. Therefore, solder paste printing requires tighter controls and quality checks, specifically in cleaning. Cleaning wet solder paste from stencils and misprinted circuit boards is not typically thought to cause downstream soldering defects, but these cleaning processes can and do contribute to soldering defects. Cleaning is a critical enabler to successfully reworking highly dense circuit assemblies. Session 5, chaired by Debbie Carboni of Kyzen Corporation, will address electronic assembly rework challenges.
The following presentations will be held during Session 5:
- George Oxx of Jabil and Rich Brooks of Kyzen Corporation will discuss process optimization for cleaning both stencils and misprinted circuit cards for acceptable downstream soldering processes.
- Eric Camden of Foresite will discuss effective spot cleaning by contrasting IPA with commercially available cleaning chemistries.
- Mike Konrad of Aqueous Technologies will discuss chemical, mechanical, environmental, and ergonomic considerations of a stencil and misprint cleaning process.
A panel discussion will follow the tech papers with the goal of collaborating with audience participants to discuss best practice considerations for reworking today’s challenging circuit assemblies. Matt Leber of Sechan Electronics, Hal Horraks of CCR, and Chris Flack of Dynaloy will join the session 5 speakers as panelists.
For more information about the conference, visit http://www.ipc.org/calendar/2010/cleaning-coating-conference-1110/cleaning-coating1110-full-brochure.htm or http://www.smta.org/education/symposia/symposia.cfm#cleaning