Technological innovation plays a crucial role in meeting the demands placed on the next generation of electronic circuitry. The speed and scale of change with which manufacturing engineers must contend increases with circuit density, solder material variations, miniaturization of microelectronics and decreased component gaps. The need for cleaning has grown in importance and complexity with electronic circuit innovations. No-clean soldering was a positive force that addressed many of these complexities.
The problem is that no-clean flux residues have become increasingly more difficult to remove under component gaps when circuit assemblies require cleaning for reliability, rework, and reprocessing misprinted boards. This problem is worsened when cleaning lead-free flux residues. The purpose of this research paper is to report the data findings from a series of designed experiments that studied the process conditions needed to remove these difficult to clean flux residues from under low component gaps.
Harvey graduated with honors from the Nottingham Trent University department of Chemistry. He is experienced in the research and development, application, and processes related to electronics assembly cleaning, conformal coating and potting, and encapsulation. Chris resides in Shanghai, P.R. China and has travelled extensively in the Asia Pacific region, supporting electronics manufacturers. For questions or more information, please e-mail firstname.lastname@example.org.
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