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Nihon Superior to Highlight Advanced Soldering Materials at SMTAI 2010

Oct 04, 2010

SN100C P602 Solder Paste.

SN100C P602 Solder Paste.

NS-F900 Wave Soldering Flux.

NS-F900 Wave Soldering Flux.

OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it will highlight its SN100C P602 Solder Paste and NS-F900 Wave Soldering Flux in booth 226 at the upcoming SMTA International exhibition, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

SN100C P602 is completely halogen-free, which means there are no intentional halogens of F, Cl, Br or even I hidden in the chemistry. The SN100C alloy delivers a silver-free stable microstructure in an alloy that can accommodate long-term cyclic strains and impact strains to which a solder joint can be subjected.

SN100C P602 has smooth bright fillets with fewer shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. SN100C provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.

Also at the show, Nihon will highlight its NS-F900, a robust, heat resistant, no-clean rosin containing wave soldering flux that is completely halogen-free. It provides high performance with high preheat temperature profiles, resulting in high topside board temperatures (up to 125°C) and long dwell times that may be required for thick boards and dense, complex assemblies while being environmentally friendly. NS-F900 is specifically designed for use with SN100C (Sn-Cu-Ni+Ge) lead-free solder but applicable to all lead-free alloys as well as Sn/Pb in wave soldering.

NS-F900 is designed to provide good hole-fill and easy solder joint inspection with little residue, while meeting JIS and J-STD-004 Surface Insulation Resistance requirements. The excellent drainage results in reduced bridging or solder shorts.

For more information, stop by booth 226 at the show or visit http://www.nihonsuperior.co.jp.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

Aug 15, 2017 -

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 10, 2017 -

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Feb 16, 2017 -

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Jan 10, 2017 -

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Oct 21, 2015 -

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 11, 2015 -

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

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