With increasing PCBA density and package complexity, reliance on AOI and X-Ray inspection to enable PCBA quality continues to grow. Strategies for optimal AOI and X-Ray application are necessary to ensure that defects are detected at the most opportunistic time with the smallest cost impact and defect escape risk.
During this session, real world users outline strategies and studies that show how to minimize defect escapes while balancing efficient utilization of inspection equipment.
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