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MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Oct 04, 2010

Prebump/Reball 03.1,  Stand Alone QFN Solder Bumping and BGA Reball Unit.

Prebump/Reball 03.1, Stand Alone QFN Solder Bumping and BGA Reball Unit.

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

The unit can handle the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.

The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain within a safe temperature zone.

For further information, visit http://www.martin-smt.de.

MARTIN has developed affordable rework, reballing, hand soldering, and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company which produces advanced rework and bonding platforms for complex applications.

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