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Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Oct 01, 2010

FINEPLACER® core rework system.

FINEPLACER® core rework system.

Martin’s Expert 10.6XL is a fully portable, cost-effective rework solution especially suited for the repair of large, high value PCBs.

Martin’s Expert 10.6XL is a fully portable, cost-effective rework solution especially suited for the repair of large, high value PCBs.

Reball/Prebump 03.1, Standalone BGA Reball and QFN Solder Bumping Unit.

Reball/Prebump 03.1, Standalone BGA Reball and QFN Solder Bumping Unit.

Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

The FINEPLACER® core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 50 x 50 mm BGAs, and handling PCBs up to 300 x 400 mm. The semiautomated design includes force measurement with automatic component lift off and placement. This compact and versatile hot-gas rework system provides a level of professionalism exceeding its attractive price. The system handles desoldering, site dressing, paste print, reballing and component replacement in one integrated platform with sophisticated integrated thermal management and a QuickStart Profile Library.

Also on display at the show, Martin’s Expert 10.6XL is a fully portable, cost-effective rework solution especially suited for the repair of large, high value PCBs. Due to its intuitive interface, process repeatability and semi-automated operation, it is an umatched value. The system includes a new hybrid under-heater and control unit, integrated into a single housing. The hybrid platform combines both infrared and convection heating technologies to achieve outstanding board temperature uniformity, thus minimizing temperature-based PCB distortion.

The Martin Reball/Prebump 03.1 is capable of handling reballing for a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The unit also accommodates the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.

Finetech is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Kuala Lumpur, Malaysia. In 2090, Finetech acquired Martin GmbH

Apr 07, 2016 -

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Nov 27, 2013 -

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Nov 08, 2013 -

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Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

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