SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Sep 30, 2010

LED PCB Manufacturing Group

LED PCB Manufacturing Group

Yash Sutariya, VP of Saturn Electronics Corporation, LED PCB Fabrication Manufacturer, to provide insight to PCB Designers and Assemblers.

At "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" at the upcoming IPC Technology Interchange on Thermal Management: Getting the Heat Out, http://www.ipc.org/calendar/2010/thermal-conference1110/thermal-brochure-1110.htm, Sutariya will provide end product solutions countering the diminishing lifespans of Light Emitting Diodes.

"Transmitting heat to less critical areas and providing increased dielectric strength in LED MCPCBs results in increased thermal conductivity while lowering thermal resistance," says Sutariya. "The way to accomplish this is to focus on your needs and to control the fabrication notes by board-specific utilization of various materials to include metal heatsink / backing, aluminum core, metal core, copper or other metallic core, or heavy copper."

SOLVING THE CHALLENGES OF THERMAL MANAGEMENT

Other presentations and workshops included at Thermal Management Conference include:

Thermal Management in PCB Design from Concept to Manufacturing

This workshop will address how to develop an effective thermal management strategy and methodology, using real-world examples. Students will develop an understanding of how thermal analysis and modeling requirements change during the course of the design cycle, from conceptual to final thermal design and manufacturability. Some specific considerations covered in this session include:

* heat sink optimization at varying stages

* weighing the pros and cons of discrete versus monolithic heat sink cooling strategies

* copper distribution capturing

* the integration with board layout tools and how they benefit the designer as the cycle progresses

About the Instructor

Nate Hanlon is a consultant engineer with the Mechanical Analysis Division engineering team at Mentor Graphics. He uses CFD tools to perform thermal and airflow analysis on a wide range of engineering problems, including electronic systems, data centers and clean rooms. Previously with the Mechanical Analysis Division, Nate specialized in the application of CFD to the design of the built environment and electronic equipment. He has a mechanical engineering degree from San Jose State University.

PCB Material Options and Properties Relative to Thermal Management

Designing for thermal management requires a thorough understanding of the materials available today. There are many different materials for thermal management PCB fabrication and they vary in thermal performance, electrical performance, and cost. Some designs may require high performance thermal materials; others may be able to utilize a more standard and economical option. This workshop will cover

* Standard and lead free compatible dielectrics (prepregs)

* Epoxy and polyimide films

* Metallic substrates (copper and aluminum)

* Formulas to help calculate which materials are necessary for your design

* Thermal and electrical characteristics as well as cost considerations

* How your material selection affects reliability of the components in your design

About the Instructors

Chris Hunrath has 28 years experience in the PCB industry starting in PCB manufacturing. The last 17 years has been in chemistry and materials supply. Chris is currently the technical director for Integral Technology, a developer of new materials for the PCB industry.

Terry Staskowicz has been involved in the PCB industry for 14 years. He has held various positions including operator, R&D technician to process engineering. For the last five years, he has been a technical account manager for Insulectro. He is also involved market research and development of thermal management materials in partnership with Integral Technologies.

Thermal Management in End Applications: Automotive

* Bruce Myers, Principal Technical Fellow, Delphi

Advancements in Heat Sinks for PCB Applications

* Dr. Sukhvinder Kang, CTO, Aavid Thermalloy

Advancements in Thermal Gels

* TBA

Package Thermal Management

* Representative from Intel

The Influence of Copper Planes in Printed Board Thermal Management

* Ken Bahl, President, Sierra Circuits

Military Platform Thermal Management and Electronics Cooling: Global and Local Optimization vs. COTS

* Gera

Saturn Electronics Corporation

Trusted Adviser: MCPCBs for LED Applications

Saturn’s DFM Engineers provide specification for the LED MCPCB that support PCB Designers in choosing pcb materials to best suit the customer's purpose and needs.

Mar 30, 2016 -

Saturn Electronics Corporation Supporting U of M Autonomy project

Oct 21, 2014 -

The University of Michigan Solar Car Team To Represent the Saturn Electronics at the 2014 SAE Convergence

Mar 18, 2013 -

Domestic PCB Fabricator Certifies Nine Employees as IPC Application Specialists Per IPC-A-600

Mar 16, 2011 -

Consult LED Thermal Management Expert

Nov 09, 2010 -

Via Plugging Guidelines

Sep 08, 2010 -

Via Hole Filling

Mar 05, 2010 -

New Material & Fabrication Process Improves LED PCB Thermal Conductivity

Dec 01, 2009 -

Thermal Management for LED Applications

Oct 27, 2009 -

LED MCPCBs

Aug 11, 2009 -

Board Shops See Increased Demand for ITAR & AS9100 PCB Fabrication Capabilities

31 more news from Saturn Electronics Corporation »

Jul 27, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Jul 27, 2017 -

CAMI Research Releases CableEye® USB Type-C Test Fixture, CB26U

Jul 27, 2017 -

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Jul 26, 2017 -

KIC Appoints Accomplished Engineering Manager

Jul 26, 2017 -

Count On Tools Inc. Reduces Pricing on the QWIKTRAY Custom Matrix Tray System

Jul 26, 2017 -

StratEdge Introduces New, Mobile-Friendly Website www.stratedge.com serves as resource for high-frequency semiconductor packages

Jul 25, 2017 -

Matt Tringhese Named Director of Program Manufacturing for Libra Industries

Jul 25, 2017 -

Europlacer Expands its Manufacturing Facility in France.

Jul 25, 2017 -

Europlacer Appoints Giantec in Taiwan

Jul 25, 2017 -

Making Ovens Smarter – Visit KIC at NEPCON South China

See electronics manufacturing industry news »

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out news release has been viewed 2697 times

  • SMTnet
  • »
  • Industry News
  • »
  • Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out
reflow oven profiler

Facility Closure