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  • Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. to Present Evaluation of Sealants used in Photovoltaic Module Manufacture at AIMS/Harsh Environments Symposium at SMTAI 2010

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. to Present Evaluation of Sealants used in Photovoltaic Module Manufacture at AIMS/Harsh Environments Symposium at SMTAI 2010

Sep 26, 2010

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will be held during Session HE3, titled “Organic Materials Adapted for Harsh Environments,” which will take place Monday, October 25, 2010 from 1-2:30 p.m. in Oceanic 7. Co-authors include Mike Moreau, Martin Gershenson, Cathy He, Yinbai Li and Miaosheng Zheng.

Over recent years, there has been an increase in the use and manufacture of solar modules. One area that has seen development is the silicone sealants used in PV module assembly with a typical application being attachment of the PV Junction Box to the backsheet material. The paper will describe the performance of the silicone adhesives used in module assembly as well as the requirements for the adhesion to and the sealing of the assembly.

Tests will cover the need to bond over a wide range of materials such as aluminum, TPT, PET and toughened glass with peel strength assessments conducted with the sealants on these substrates after damp-heat testing. It also will compare the sealing performance for a range of sealants by exposing the sealants to high temperature and humidity, and measuring mechanical properties such as the change in tensile strength, elongation and hardness. Additionally, an assessment of the different reaction rates of the sealant with the EVA film will be discussed along with the sealant processability.

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