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Reflow Oven Video Released for Surface Mount Printed Circuit Board Assembly from APS Novastar

Sep 24, 2010

APS Novastar is pleased to announce the release of its new video providing an overview of its Reflow Oven products for lead-free and lead based reflow soldering, curing, and thermal cycling applications. This short video can be viewed on the APS Novastar web site, as well as the company's YouTube Channel (http://www.youtube.com/watch?v=o3wyoe8x6X4).

The company's Reflow Oven product line consists of compact benchtop reflow ovens to higher volume production models. The video details the many unique features of the company's Reflow Oven product line. Also illustrated is the company's patented Horizontal ConvectionTM technology, which enables APS Novastar Reflow Ovens to provide highly accurate, consistent, and reliable thermal profiles for exceptional reflow results. The Horizontal Convection technology, which creates a cyclone of air circulated around the printed circuit board, provides improved thermal penetration across the board and yields better results with tough-to-solder components such as BGAs and J-leaded quad flat packs.

About APS Novastar

APS Novastar, LLC, established in 1982, recipient of a 2009 Frost & Sullivan Best Practices Award, is the global leader in the design, development, and manufacture of OEM equipment for the short to medium run surface mount technology (SMT) and printed circuit board (PCB) markets. APS Novastar's products include stencil printers, automatic pick and place robots, reflow ovens, wave and selective solder equipment, component counters and lead forming equipment. APS Novastar has installed over 20,000 product solutions in the telecom, defense and aerospace, security, transportation, automotive, medical device and diagnostics, personal computer, display, and academic markets. For more information, visit http://www.ddmnovastar.com or call +1.215.938.1000.

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