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  • MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Sep 15, 2010

Standalone QFN Solder Bumping and BGA Reball Unit

Standalone QFN Solder Bumping and BGA Reball Unit

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

The unit can ahandle the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.

The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain within a safe temperature zone.

For further information please see http://www.martin-smt.de.

MARTIN has developed affordable rework, reballing, hand soldering, and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company which produces advanced rework and bonding platforms for complex applications.

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