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See Kyzen’s MICRONOX® MX2302 Wafer-level Cleaning Solution on Display at IWLPC 2010

Sep 13, 2010

NASHVILLE, TN — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will display its MICRONOX® MX2302 Wafer-level Cleaning Solution at the upcoming International Wafer-Level Packaging Conference and Tabletop Exhibition, scheduled to take place October 13-14, 2010 at the Marriott Hotel in Santa Clara, CA

MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.

MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.

MICRONOX® MX2302 is available in one, five, and 55 gallon containers.

Kyzen® and MICRONOX® are registered trademarks in the United States and other countries.

Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant. For more information, visit http://www.kyzen.com

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