SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)

Free Sessions at Electronics Midwest Focus on Best Practices for Manufacturing Electronics of Tommorow

Sep 13, 2010

BANNOCKBURN, IL - IPC — Association Connecting Electronics Industries® will bring together some of the brightest minds in the electronics industry for three free technical sessions at Electronics Midwest. Held September 28–29, 2010, at the Donald E. Stephens Convention Center, in Rosemont, Ill., the sessions will provide answers and insights into the challenges in printed board fabrication and assembly technologies as well as manufacturing with sustainability in mind.

On Tuesday, September 28, Carol Handwerker, Sc.D., Reinhardt Schuhmann, Jr. professor of materials engineering at Purdue University, will present the opening session, “Designing Electronics for Tomorrow and Manufacturing with Sustainability in Mind.” A vital topic for both national and international research activities, sustainability requirements drive behavior within electronics R&D as well as materials choices and manufacturing. As Dr. Handwerker explains, “The economic and environmental dynamics associated with sustainability can make the difference between companies that survive and thrive and those that die.” She will share her experiences throughout the electronics industry as well as her extensive knowledge of materials and metallurgy to provide insights and a true understanding of next generation technologies.

IPC has assembled two panels of experts to provide industry members with solutions to common fabrication and assembly problems. In the “Challenges in Printed Board Fabrication,” Free Forum on September 28, Chris Mahanna, Robisan Laboratory, Inc.; Wendi Boger, DDi; and Nick Koop, CID, Minco Products will discuss challenges involving:

via fill, stacked vias and cap plating processes; thermal stress methodologies; and the new requirements set forth in IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, as well as when rigid-flex printed boards should be used. In addition, the panelists will touch on how tightly a flex circuit can be bent, and lot acceptance and conformance testing.

The Free Forum on September 29 will focus on the “Challenges in Printed Board Assembly Technology.” Renowned industry experts Jennie Hwang, Ph.D., H-Technologies Group; Teresa Rowe, AAI Corporation; and Greg Munie, Ph.D., IPC, will answer attendees’ questions on electronics assembly issues, including: electronics manufacturing and EMS market trends; emerging interconnect technologies; current assembly issues and remedies; solder paste technology; lead-free solder joint reliability testing and performance; and printed board surface finishes.

For more information on the free IPC programs at Electronics Midwest or to register, visit Free, exhibits-only registration is available to qualified pre-registrants ($55 on-site). Visit to view special registration packages to attend the IPC Technical Conference and other IPC activities. Electronics Midwest is produced by IPC and Canon Communications.

IPC ( is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Canon Communications LLC ( is the leading producer of face-to-face, digital, print, and online business acceleration products for the world’s $3 trillion advanced, technology-based manufacturing industry, including medical device, packaging, design engineering, process technology, automated assembly, electronics, quality control, and plastics processing.

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