SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Sep 02, 2010

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.

Peter will present "The European 3D Technology Platform for Heterogeneous Systems" at the Kick-Off Reception on Tuesday, October 12 from 5:00 - 6:30pm. Mr. Ramm will discuss the European 3D technology platform that has been established within the EC funded e-CUBES project, focusing on the requirements coming from heterogeneous systems.

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event is sponsored by Amkor Technology, EV Group, NEXX Systems, Pac Tech USA, and Technic Inc.

Visit http://www.iwlpc.com for more information.

Contact Melissa Serres at 952-920-7682 or melissa@smta.org with questions.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Jun 20, 2017 -

SMTA Launches New Partnership with Thayer School of Engineering at Dartmouth College

Jun 08, 2017 -

SMTA International Conference Program Finalized and Registration Now Open

May 30, 2017 -

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

May 23, 2017 -

SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium

May 15, 2017 -

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

547 more news from Surface Mount Technology Association (SMTA) »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC) news release has been viewed 1458 times

  • SMTnet
  • »
  • Industry News
  • »
  • Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)
bga rework stations

SMT Services - STI Electronics