Peter will present "The European 3D Technology Platform for Heterogeneous Systems" at the Kick-Off Reception on Tuesday, October 12 from 5:00 - 6:30pm. Mr. Ramm will discuss the European 3D technology platform that has been established within the EC funded e-CUBES project, focusing on the requirements coming from heterogeneous systems.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event is sponsored by Amkor Technology, EV Group, NEXX Systems, Pac Tech USA, and Technic Inc.
Visit http://www.iwlpc.com for more information.
Contact Melissa Serres at 952-920-7682 or firstname.lastname@example.org with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.