SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nihon Superior Co., Ltd.


Nihon Superior Wins ICEP Outstanding Paper Award

Sep 02, 2010

Tetsuro Nishimura, President of Nihon Superior.

Tetsuro Nishimura, President of Nihon Superior.

OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award. The award, presented during the opening ceremony of ICEP 2010 in Sapporo on May 12, was for the paper titled “Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders.” The paper was presented by the lead author, the University of Queensland's Associate Professor Kazuhiro Nogita, at ICEP 2009 in Kyoto.

The paper, which reports a phenomenon that explains a major contribution to the reliability of Nihon Superior’s SN100C® solder alloy, was co-authored by Stuart McDonald, Hideaki Tsukamoto and Jonathan Read of the University of Queensland, the president of Nihon Superior, Tetsuro Nishimura, and Shoichi Suenaga of Nihon Superior.

The authors successfully developed a method of limiting cracking in the Cu6Sn5 intermetallic compounds, which are formed at the interface between lead-free solders and their Cu substrates. In this paper, it is shown that the level of cracking in the (Cu,Ni)6Sn5 reaction layer and the morphology of the intermatallics varies with the Ni content. To explore the mechanisms associated with the differences in joint integrity, detailed synchrotron X-ray powder diffraction (XRD) has been used with Rietveld analysis. The results show Ni stabilizes a high-temperature allotrope of the Cu6Sn5 phase, avoiding stresses induced by a volumetric change that would otherwise occur on phase transformation.

For more information, visit http://www.nihonsuperior.co.jp.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

You must be a registered user to talk back to us.

More News from Nihon Superior Co., Ltd.

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Oct 21, 2015 -

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 11, 2015 -

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

Aug 26, 2015 -

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

Jun 21, 2015 -

Nihon Superior Acknowledged for 2015 SMTAI Sponsorship

Jan 27, 2015 -

Nihon Superior Announces Successful Product Launches at NEPCON Japan

Jan 19, 2015 -

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

(121) more news from Nihon Superior Co., Ltd.

Nihon Superior Wins ICEP Outstanding Paper Award news release has been viewed 553 times

Flying Probe Tester

PCB Buffers