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MIRTEC To Premier Its Complete Line of Technologically Advanced Automated Optical Systems at IPC Electronics Midwest 2010

Sep 01, 2010

MV-7xi In-Line AOI System

MV-7xi In-Line AOI System

MV-3L Desktop AOI System.

MV-3L Desktop AOI System.

MIRTEC, "The Global Leader in Inspection Technology", announced that it will premier its complete line of inspection systems at in booth #7617 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.

At the show, MIRTEC will be exhibiting the latest in its award-winning MV-7 Series; the MV-7xi In-Line AOI System. Fully configured, this system provides one top down view Five Mega Pixel camera, with a Precision 9.8 Micron Telecentric Compound Lens and four Five Mega Pixel Side-View Cameras. The patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi will feature a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan Laser System. The MV-7xi provides the “Third Dimension” in inspection capability - the ability to precisely measure the Z-height of a given region of interest. This advanced technology offers; superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The system is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.

MIRTEC also will exhibit its award-winning MV-3L Desktop AOI System. The MIRTEC MV-3L is the industry’s most widely accepted Five Camera Desktop AOI system. The system is configured with a Top-Down View Five Mega Pixel camera, with a Precision 9.8 Micron Telecentric Compound Lens and four Five Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

Visitors will be able to find out more about MIRTEC’s total quality management system software, Intellisys. The software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and monitoring of up to eight production lines allowing MIRTEC customers to further maximize the efficiency of their inspection process. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.

“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” stated Brian D’Amico, President of MIRTEC Corp. ““We are eager to display the latest advancements to our award-winning inspection systems at IPC Electronics Midwest this year. We look forward to welcoming visitors to our booth #7617 throughout the event.”

MIRTEC is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For further information please visit our website at http://www.mirtecusa.com

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