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Seika Machinery, Inc. to Highlight HIOKI Flying Probe and Anritsu SPI System at SMTA Capital Expo & Tech Forum

Aug 26, 2010

Seika HIOKI flying probe.

Seika HIOKI flying probe.

Seika Anritsu 3D Solder Paste Inspection System.

Seika Anritsu 3D Solder Paste Inspection System.

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its HIOKI Flying Probe ICT with AOI functions and Anritsu SPI System at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

The HIOKI flying probe provides a variety of benefits over conventional testing machinery. Some of these benefits include jig-less inspection for quick setup and the proficient testing of mis-mounted components, faulty components, and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while still thwarting board damage through use of the soft-landing feature.

With its variety of measurement abilities for analyzing data and the high-quality speed of testing, the flying probe tester is a cost-effective way to efficiently and quickly assess any circuit board.

The Anritsu 3D Solder Paste Inspection System features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 sq cm/sec at 20 µm resolution; 13.8 sq cm/sec at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided regardless of the operator.

Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.

Product literature also will be distributed for all of Seika Machinery’s products. For more information about Seika’s full product line, visit Seika at the SMTA Capital Expo & Tech Forum or visit http://www.seikausa.com.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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