SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Seika Machinery, Inc. to Highlight HIOKI Flying Probe and Anritsu SPI System at SMTA Capital Expo & Tech Forum

Seika Machinery, Inc. to Highlight HIOKI Flying Probe and Anritsu SPI System at SMTA Capital Expo & Tech Forum

Aug 26, 2010

Seika HIOKI flying probe.

Seika HIOKI flying probe.

Seika Anritsu 3D Solder Paste Inspection System.

Seika Anritsu 3D Solder Paste Inspection System.

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its HIOKI Flying Probe ICT with AOI functions and Anritsu SPI System at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

The HIOKI flying probe provides a variety of benefits over conventional testing machinery. Some of these benefits include jig-less inspection for quick setup and the proficient testing of mis-mounted components, faulty components, and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while still thwarting board damage through use of the soft-landing feature.

With its variety of measurement abilities for analyzing data and the high-quality speed of testing, the flying probe tester is a cost-effective way to efficiently and quickly assess any circuit board.

The Anritsu 3D Solder Paste Inspection System features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 sq cm/sec at 20 µm resolution; 13.8 sq cm/sec at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided regardless of the operator.

Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.

Product literature also will be distributed for all of Seika Machinery’s products. For more information about Seika’s full product line, visit Seika at the SMTA Capital Expo & Tech Forum or visit http://www.seikausa.com.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

May 03, 2017 -

Effectively Test Wetting Balance of Component Leads with the New MALCOM SWB-2 Dip Wetting Tester

Feb 23, 2017 -

Seika Recognizes Top Performing McDry Reps during APEX

Feb 01, 2017 -

New Bubble Washer System for Stubborn Flux Cleans Five Times Faster than Immersion Cleansing

Jan 11, 2017 -

Seika Machinery to Bring New Kawaski Dual Arm SCARA Robot to APEX

Jan 10, 2017 -

New SAWA Ultrasonic Squeegee Cleaner Presents New Solution for Lead-Free Pastes

Jan 09, 2017 -

Explore Industry-Leading Equipment from Seika Machinery at APEX

Sep 12, 2016 -

Seika Machinery to Bring a Modular Reflow Oven Profiling System to SMTA Guadalajara

Sep 08, 2016 -

Attend the SMTA Ambassador Reception during SMTAI

Sep 01, 2016 -

Attend the 7th Annual SMTA Women’s Leadership Program at SMTAI

Aug 30, 2016 -

Seika Announces Special Show Floor Pricing for the Sawa Handy Cleaner and McDry Cabinet at SMTAI

184 more news from Seika Machinery, Inc. »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

Seika Machinery, Inc. to Highlight HIOKI Flying Probe and Anritsu SPI System at SMTA Capital Expo & Tech Forum news release has been viewed 1028 times

  • SMTnet
  • »
  • Industry News
  • »
  • Seika Machinery, Inc. to Highlight HIOKI Flying Probe and Anritsu SPI System at SMTA Capital Expo & Tech Forum
PCB equipment

PCB machines