SMT, PCB Electronics Industry News

ECT’s CPG To Showcase The Zip® Family at Semicon Taiwan 2010

Aug 24, 2010

The Zip® pins Series is designed to meet today’s demanding test requirements and economics.

The Zip® pins Series is designed to meet today’s demanding test requirements and economics.

Pomona, CA - Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest new additions to its ZIP® family of “flat” technology Pogo® pins in booth 840 in Hall 1 at the upcoming Semicon Taiwan, scheduled to take place September 8-10, 2010 at the Taipei World Trade Center in Taipei, Taiwan.

ECT’s Contact Products Group’s display will highlight its expanded line of available pitches from 0.8 to 0.2 mm center spacing. ECT also will feature the high-performance Bantam®, the pin of choice for the most demanding test applications; the Mini-Mite™, for higher current and consistent C-res requirements; and the CSP series, for a wide variety of double-ended Pogo technology applications with drop-in compatibility for many competitor test probes. ECT’s CPG personnel will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its new range of products, which includes:

ZIP SCRUB™ ― The ZIP SCRUB pin features a positive “scrub-action” pad and ball contact on lead-free plated array and peripheral devices where solder transfer causes frequent cleaning and maintenance cycles.

ZIP KELVIN ― ECT’s ZIP KELVIN is ideal for voltage sensitive device tests on array or peripheral devices requiring sub-1 ohm resistance measurements typical in RDSON and high-power applications.

ZIP SUPER SHORT ― The SUPER SHORT is designed for 0.5nH low impedance, high frequency testing.

ZIP LongTravel ― The ZIP LongTravel, with an OAL up to 6.7mm, was developed for contacting large devices and strip tests where planarity and compliance are an issue.

Z8 ―The Z8 is suited for burn-in applications and combines the performance features of the standard ZIP in a “burn-in-price-point” replaceable compliant pin.

The ZIP patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP Series is designed to meet today’s demanding test requirements and economics.

Everett Charles Technologies is a subsidiary of Dover Corporation (NYSE: DOV) a leading manufacturer of electrical test products and services, including Pogo® test contacts, semiconductor test products, bare-board automatic test systems, and bare and loaded PCB test fixtures. ECT manufacturing, service, and support facilities are ISO registered with locations throughout the United States, Europe, and Asia. The company has been awarded numerous patents and participates actively in developing industry standards. Corporate offices for Everett Charles Technologies are located at 700 E. Harrison Ave., Pomona, California, USA, 91767. Additional information about ECT is available via the Internet at http://www.ectinfo.com

Apr 23, 2014 -

Everett Charles Technologies Brings the Latest Advances in Electrical Testing to DMEDS

Jan 14, 2014 -

ECT to Introduce High-Performance Radial Connectors at ATX/MD&M West

Jan 07, 2014 -

ECT Releases High-Performance Radial Connectors

Nov 20, 2013 -

ECT Offers ZIP® Z0 and Z1 Contacts in HyperCoreTM Base Material

Oct 11, 2013 -

ECT to Showcase Electrical Test Products and Services at Productronica

Sep 17, 2013 -

ECT Technical Expert to Discuss Breakthrough PCBA Test Probe Technologies at SMTAI 2013

Sep 12, 2013 -

ECT to Bring Compliant Connector Solutions to SMTAI 2013

Aug 12, 2013 -

New Compliant Connector Solutions from ECT at ITC 2013

Mar 29, 2013 -

ECT to Exhibit at the Del Mar Electronics & Design Show

Jan 29, 2013 -

ECT to Offer Innovative Solutions at the IPC APEX EXPO Learn about Our Full Line of Electrical Test Products and Services

62 more news from Everett Charles Technologies »

Aug 23, 2017 -

Count On Tools Inc. Expands Panasonic Nozzles for AM100 Placement Equipment

Aug 23, 2017 -

Saelig Introduces Industrial Raspberry Pi Controller ComfilePi

Aug 23, 2017 -

Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Aug 23, 2017 -

Hanwha Techwin and ESE Partner to Bring Customers Value and Versatility

Aug 23, 2017 -

Laser Design CyberGage®360, Automated 3D Scanning & Inspection System Adopted by Proto Labs in Their State-of-the-Art Metrology Lab

Aug 23, 2017 -

ZESTRON to Feature HYDRON® Technology at SMTAI

Aug 23, 2017 -

The Hermes Standard: Viscom working on first field tests

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

See electronics manufacturing industry news »

ECT’s CPG To Showcase The Zip® Family at Semicon Taiwan 2010 news release has been viewed 719 times

Reflow Oven

Reflow Ovens thermal process improvement