Until recently, most SMT assemblers considered the task of cleaning stencils a “maintenance” function only. However, process engineers now estimate that approximately 70% of surface mount technology defects are due to solder paste printing problems and many of those problems can be traced back to a contaminated stencil.
Assemblers can now download 17 different resource articles to help explain the best cleaning technologies and methods relating to optimal stencil and misprinted PCB cleaning along with process issues related to wastewater management and the potential environmental impact of the process.
In addition, because of “no-clean” technology, the stencil cleaner is often the last piece of cleaning equipment left on the production floor and therefore often called upon to clean other applications such as pallets, oven radiators SMD adhesives and associated tooling used in the SMT printing process. Visitors to the new website will also find information pertaining to these applications and much more. http://www.SmartSonic.com