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CyberOptics to Showcase World’s Fastest AOI System and Newest SPI System at NEPCON South China 2010

Aug 10, 2010

The QX500 embraces CyberOptic's unique image acquisition solution - Strobed Inspection Module (SIM) and is capable of inspecting 01005 components and larger at 100 cm2/sec, securely positioning itself as the fastest area-scannng Automated Optical Inspection system in the industry.

The QX500 embraces CyberOptic's unique image acquisition solution - Strobed Inspection Module (SIM) and is capable of inspecting 01005 components and larger at 100 cm2/sec, securely positioning itself as the fastest area-scannng Automated Optical Inspection system in the industry.

The SE350 is capable of inspecting the most demanding assemblies with 80 cm2/second inspection speed.  Not just simpler and fast, SE350 also offers uncompromised measurement accuracy and repeatability even at such high speeds.

The SE350 is capable of inspecting the most demanding assemblies with 80 cm2/second inspection speed. Not just simpler and fast, SE350 also offers uncompromised measurement accuracy and repeatability even at such high speeds.

CyberOptics Corporation (NASDAQ: CYBE) will feature its latest award winning SPI and AOI In-Line inspection Systems at the upcoming NEPCON South China 2010 scheduled to take place on August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.

CyberOptics’ innovative QX500™ AOI system is designed with a unique image acquisition solution - Strobed Inspection Module (SIM), bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and extremely low false failure rate. The introduction of strobed white lighting in QX500™ makes it the only AOI system to provide ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec, setting it apart from other conventional AOI counterparts. The QX500™ dual fixed angle lighting provides superb image quality for advanced automated inspection of solder and lead defects, presence and position, correct part and polarity, for inspection of components down to 01005 size.

CyberOptics will also highlight the award winning SE500™, 100% 3D solder paste inspection system (SPI) and the newest addition to its 3D SPI system portfolio – the simplistic and robust SE350™. The SE series SPI systems are equipped with CyberOptics’ calibration-free 3D sensor technology to inspect even the most demanding assemblies at 80 cm²/second inspection speeds or greater, without compromising on measurement accuracy and repeatability. The sensor is an integrated assembly designed with no moving parts eliminating machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry.

We are very excited about showcasing our latest SPI and AOI systems at this year's NEPCON South China," said Dennis Rutherford, CyberOptics Inspection Systems Vice President of Global Sales & Marketing. “Our expanded and innovative SPI and AOI product line-up combined with a renewed focus in the South China will help us re-establish CyberOptics as the leading inspection solutions provider in the region”.

For further information, please visit CyberOptics’ booth 2C48 at NEPCON South China 2010 or visit http://www.cyberoptics.com.

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company’s Web site at http://www.cyberoptics.com.

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