Indium8.9HF-1 was specially designed to be extremely thermally stable and maintain a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing.
Indium8.9HF-1 has a high oxidation barrier to eliminate graping and head-in-pillow defects.
Indium8.9HF-1 has excellent print transfer efficiency on 0.4mm pitch CSPs and is halogen-free per the EN14582 test method.
Indium8.9HF-1 exhibits low voiding (
Indium8.9HF-1 is also compatible with Sn/Pb alloys.
The performance benefits customers obtain by using Indium8.9HF-1 result in increased cost savings and the highest finished goods reliability.
Indium will be exhibiting at Booth 2F55.