The ATS Spray Fluxer, developed by SEHO, has several advantages. In this closed system, a rotary pump continuously transports the flux from the flux container into a bypass system. For spraying, a bypass valve interrupts the circuit and leads the flux to the spray head.
The new spray head uses HVLP technology (high volume, low pressure) that generates atomization of the flux with a comparatively low pressure. This ensures a stable spray jet with a very homogeneous spray pattern and an extremely good boundary at the outer edges to enable a remarkable reduction of the flux consumption. Overall, this low-pressure system creates considerably less spray mist, reducing soiling in the fluxer area and minimizing maintenance requirements.
With the ATS Spray Fluxer, both flux quantity and spray pressure are adjustable. All connections are designed as quick-acting closures and the spray head is quickly exchangeable. Additionally, the flux container, which is equipped with an additional cover, can be taken out completely to allow easy cleaning. All electrical and pneumatic parts remain in the soldering system.
The innovative ATS Spray Fluxer with HVLP technology is available for all wave soldering systems from SEHO and may be refitted for older machines.
For more information about SEHO’s ATS Spray Fluxer, visit http://www.seho.de.
Since its foundation in 1973, SEHO has become the worldwide contact partner whenever soldering is involved. Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. As a result, all applicable environmental standards are complied with meticulously. With its systems, the company provides customers with a sustained and resource economizing production facility. It continuously develops its technology in order to provide customers with a competitive advantage. For more information, visit http://www.seho.de.