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Christopher Associates Introduces New Solder Paste Printing Process Guide

Jul 12, 2010

Christopher Associates is proud to have sponsored a recent study conducted by noted industry expert Chrys Shea. The research identified the root causes of defects in the stencil printing process.

Shea used Koh Young’s solder paste inspection systems to capture images of critical defects and corrective actions. The results of this work were presented at the SMTA Twin Cities chapter meeting in Minneapolis, MN.

Christopher Associates is committed to the long-term success of its customers. The company offers engineering and technical support, as well as global logistics to its growing customer base in the photovoltaic industry from several locations in North and Central America.

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Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO

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Christopher Associates to Display High-Magnification Tagarno Magnus HD Trend at Both SMTA Dallas and Houston 2012

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Christopher Associates' Jasbir Bath to Moderate Solder Joint Testing and Performance Meeting at IPC APEX 2012

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Christopher Associates' Jasbir Bath to Present on Lead-free Alloys at IPC APEX 2012

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Christopher Associates to Unveil New SPI Unit at the 2012 IPC APEX Expo

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