The AIMS Harsh Environments Symposium addresses the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability.
Session topics include Pb-Free Technology Insertion, Component Packaging Challenges in Harsh Environments, Organic Materials Adapted for Harsh Environments, and Interconnection Reliability. Papers will be presented by Raytheon, GE Aviation, IBM, and Harris Corporation among others. The Harsh Environments Keynote Lunch will feature Irene Sterian, Celestica Inc., presenting "The Tech in Green Tech."
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.