Seika will feature product literature and CDs, as well as the Sawa Eco-Roll, which eliminates waste and saves money by reusing wiper rolls for printing machines. In addition to providing a reduction in waste, use of the wiper roll cleaner results in reduced CO2 emissions. The SC-ER360 cleans wiper rolls in just 20 minutes and measures W900 x D850 x H1200 mm.
Wiper rolls are widely used for under-stencil cleaning to wipe off solder paste in the SMT printing process. Most of them are used only once and then disposed of with other solder waste. Recycling wiper rolls not only reduces emissions but also reduces lumber usage. Additionally, tests have shown that repeated cleaning of wiper rolls does not compromise the performance when cleaning stencil apertures.
Also at the show Seika will highlight its new Solder Paste Recycling Unit. The environmentally conscious system enables the separation of flux and solder, using a special solder pot mechanism that inverts during each cycle. In approximately 35-45 minutes, the unit turns wasted solder paste into solder bar. The maximum volume per cycle is approximately 5.5 lb (2.5 kg).
The easy-to-use system enables approximately 90 percent of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced costs for solder bar as a result of recycling waste.
Product literature also will be distributed for all of Seika Machinery’s products. For more information about Seika’s full product line, visit Seika at the SMTA Ohio Valley Expo & Tech Forum or visit http://www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.