Attendees will benefit by gaining the latest knowledge with six application-oriented tutorials, expert panel discussions, a presentation from distinguished keynote speaker Dr. Bradley McCredie from IBM, and 15 tech sessions.
The conference will include three tracks with papers covering:
- Wafer Level Packaging
- MEMS Packaging
- 3-D Integration
Exhibit space is limited but there are still tabletop spaces available. Please contact Leslee Johns, email@example.com, at SMTA with questions or for more information about the exhibition.
This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Visit http://www.iwlpc.com for more information.
Contact Melissa Serres at 952-920-7682 or firstname.lastname@example.org with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.