The International Microelectronics And Packaging Society (IMAPS) is proud to announce two world-renowned industry leaders as Keynote Speakers at the 43rd International Symposium on Microelectronics (IMAPS 2010, November 2-4, 2010, Raleigh Convention Center, Raleigh, NC.
Dr. John Edmond co-founded Cree Research, Inc. Since its founding, Dr. Edmond has worked on the development and production of blue and green LEDs, first in SiC, then the Group III Nitrides on SiC. In July 2007, Edmond earned a place on Business 2.0s ‘50 Who Matter Now’ list. The distinction places him alongside business celebrities such as Steve Jobs, founder and CEO of Apple, and the chiefs of Amazon, Cisco and Google. He graduated summa cum laude from Alfred University in 1983 with a Bachelor of Science degree in Ceramic Engineering and earned his PhD in Materials Prof. Science at NC State University in 1987.
Dr. Edmond will speak on Tuesday, November 2, 2010.
Dr. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging - alumina, glass-ceramic-copper and copper-polymer thin film - and materials for ink-jet printing and magnetic storage.
Dr. Tummala has received many industry, academic and professional society awards including Industry Week’s award for improving U.S. competitiveness, IEEE's David Sarnoff, Major Education and Sustained Technical awards, Dan Hughes award from IMAPS, Engineering Materials Achievement award from DVM and ASM-International, Total Excellence in Manufacturing award from SME, John Jeppson’s award from the American Ceramic Society as well as Distinguished Alumni awards from the University of Illinois, the Indian Institute of Science, Bangalore and Georgia Tech. He received a BS from IISc, Bangalore and Ph.D. from the University of Illinois.
Dr. Tummala will speak on Wednesday November 3, 2010.
“It is an honor to have two internationally respected industry leaders speaking at IMAPS 2010. These gentlemen are unparallel in their scientific and educational contributions to our technologies and we look forward to their participation,” stated Howard Imhof, Metalor Technologies, USA and 2010 IMAPS President.
IMAPS 2010 will be the largest symposium in the world related to microelectronics packaging. IMAPS 2010 will feature a powerful technical program, a state-of-the-art exposition, progressive professional development courses, another informative Global Business Council Marketing Forum, and many other events and activities to share the latest developments in microelectronics.
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia. Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system.