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FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Jun 23, 2010

FINEPLACER® Lambda, Sub-Micron Bonder

FINEPLACER® Lambda, Sub-Micron Bonder

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring precision, advanced technologies and the highest bonding placement accuracy (down to ± 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies ― soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, adhesives, and curing.

Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (W2W, C2W), optoelectronic and micro optics bonding and assembly, sensors and more. The system handles component sizes from 0.15mm to 60mm and special tools allow object sizes down to 5 micron.

For more information, visit the company in booth 5570 or visit http://www.finetechusa.com.

FINETECH is a leading manufacturer of innovative rework and advance packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquar Au/Sn tered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

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