SMT, PCB Electronics Industry News

ECT’s CPG TO SHOWCASE THE ZIP™ FAMILY AT SEMICON WEST 2010

Jun 23, 2010

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest new additions to its ZIP™ family of “flat” technology Pogo® pins in booth 5870 at the upcoming Semicon West, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

ECT’s Contact Products Group’s display will highlight its expanded line of available pitches from 0.8mm down to 0.2mm center spacing. ECT will also feature the high-performance Bantam®, the pin of choice for the most demanding test applications; the Mini-Mite™, for higher current and consistent C-res requirements; and the CSP series, for a wide variety of double-ended Pogo technology applications with drop-in compatibility for many competitor test probes. ECT CPG personnel will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its new range of products, which includes:

ZIP SCRUB™ ― The ZIP SCRUB pin features a positive “scrub-action” pad and ball contact on lead-free plated array and peripheral devices where solder transfer causes frequent cleaning and maintenance cycles.

ZIP KELVIN ― ECT’s ZIP KELVIN is ideal for voltage sensitive device tests on array or peripheral devices requiring sub-1 ohm resistance measurements typical in RDSON and high-power applications.

ZIP SUPER SHORT ― The SUPER SHORT is designed for 0.5nH low impedance, high frequency testing.

ZIP LongTravel ― The ZIP LongTravel, with an OAL up to 6.7mm, was developed for contacting large devices and strip test where planarity and compliance are an issue.

Z8 ― The Z8 is suited for burn-in applications, and combines the performance features of the standard ZIP in a “burn-in-price-point” replaceable compliant pin.

The ZIP patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP Series is designed to meet today’s demanding test requirements and economics.


Everett Charles Technologies, a subsidiary of Dover Corporation (NYSE: DOV), is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, Pogo test contacts, and bare and loaded PCB test fixtures. ECT manufacturing, service, and support facilities are ISO registered with locations throughout the Asia, the United States, and Europe. The company has been awarded numerous patents and participates actively in developing industry standards. Corporate offices for Everett Charles Technologies are located at 700 E. Harrison Ave., Pomona, California, USA, 91767. Additional information about ECT is available via the Internet at http://www.ectinfo.com

Apr 23, 2014 -

Everett Charles Technologies Brings the Latest Advances in Electrical Testing to DMEDS

Jan 14, 2014 -

ECT to Introduce High-Performance Radial Connectors at ATX/MD&M West

Jan 07, 2014 -

ECT Releases High-Performance Radial Connectors

Nov 20, 2013 -

ECT Offers ZIP® Z0 and Z1 Contacts in HyperCoreTM Base Material

Oct 11, 2013 -

ECT to Showcase Electrical Test Products and Services at Productronica

Sep 17, 2013 -

ECT Technical Expert to Discuss Breakthrough PCBA Test Probe Technologies at SMTAI 2013

Sep 12, 2013 -

ECT to Bring Compliant Connector Solutions to SMTAI 2013

Aug 12, 2013 -

New Compliant Connector Solutions from ECT at ITC 2013

Mar 29, 2013 -

ECT to Exhibit at the Del Mar Electronics & Design Show

Jan 29, 2013 -

ECT to Offer Innovative Solutions at the IPC APEX EXPO Learn about Our Full Line of Electrical Test Products and Services

62 more news from Everett Charles Technologies »

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

See electronics manufacturing industry news »

ECT’s CPG TO SHOWCASE THE ZIP™ FAMILY AT SEMICON WEST 2010 news release has been viewed 783 times

IPC Training & Certification - Blackfox

SMT Replacement Nozzles