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Dr. Bradley McCredie to Present Keynote at 2010 International Wafer-Level Packaging Conference

Jun 21, 2010

Minneapolis, MN - The SMTA and Chip Scale Review magazine proudly announce that Bradley McCredie, Ph.D., IBM Fellow and Vice President of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference being held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College".

Dr. Bradley McCredie received his Ph.D. in electrical and computer engineering from the University of Illinois in 1991. He joined IBM and continued his work in packaging focused on IBM's mainframe systems. In 1996 he began working on POWER based systems. In 2004 Dr. McCredie was appointed to the position of IBM Fellow, IBM’s highest technical position; then in 2009 he was appointed to the position of IBM Vice President and Fellow and is now leading all POWER chip development for IBM systems.

This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

For more information on IWLPC contact Melissa Serres at 952-920-7682 or melissa@smta.org.

Visit http://www.iwlpc.com/special_events.cfm#keynote for more details.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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