SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council

Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council

Jun 04, 2010

BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.

The advent of regulations in Asia and Europe restricting the use of certain substances has forced solder material suppliers to provide the electronics industry with solders that are lead free and, at the same time, provide all the needed properties, including reliability and ease of assembly. Since then, solder suppliers have focused their efforts on improving their products and offering an ever-growing choice of alloys. Unfortunately, the lack of physical data available for these new alloys as well as inconsistent test methodology makes it virtually impossible to compare alloy properties and introduces uncertainty as to which to use.

The SPVC white paper prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. The document describes material tests that generate portable data for: (1) direct comparison of different alloys; (2) aiding in alloy acceptability determination for various applications; (3) development of reliability models; and (4) other uses.

For more information on Analytical Procedures for Portable Lead-Free Alloy Test Data or to download the free white paper, visit http://www.ipc.org/SPVC-LAT1. For more information on the activities of the IPC SPVC, contact Tony Hilvers, IPC vice president of industry programs, at TonyHilvers@ipc.org.

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 21, 2018 -

Ventec International Group Awarded IPC-4101/40 Qualified Products Listing Certification

May 15, 2018 -

Electronics Industry Executives Meet in DC to Urge Action on Pro-Manufacturing Policies

May 15, 2018 -

IPC Automotive Electronics Reliability Forum Highlights Future of Automotive Electronics Design and Manufacturing

May 13, 2018 -

IPC and ITI to Host Conference on Critical and Emerging Environmental Product Requirements

May 13, 2018 -

Electronics Industry Says Trump Administration Tariffs on China Could Harm U.S. Electronics Companies

May 01, 2018 -

IPC to Host High Reliability Forum in Baltimore Technical conference to focus on electronics subjected to harsh use environments

Apr 26, 2018 -

North American PCB Industry Growth Continues Upward

Apr 24, 2018 -

IPC Assembly Quality Benchmark Study Open to Participants, Survey Deadline Extended to April 30

Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

910 more news from Association Connecting Electronics Industries (IPC) »

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

May 22, 2018 -

Koh Young Continues to Strengthen its Support Network for the Americas

May 21, 2018 -

Naprotek, Inc. Installs Flexible New MXI System

May 21, 2018 -

Ersa Holds National Sales Meeting with Hands on Training

May 21, 2018 -

New Lightweight Cartridge Applicators from Techcon

May 21, 2018 -

KIC to Discuss Closing the Loop at SMT/Hybrid/Packaging

See electronics manufacturing industry news »

Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council news release has been viewed 929 times

  • SMTnet
  • »
  • Industry News
  • »
  • Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council
Used SMT Equipment

FPC* - Fluid Pressure Control - Dispensing Pump