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Christopher Associates Introduces New SPC Software Package for Solder Paste Inspection

May 29, 2010

Christopher Associates Inc. today introduced a powerful new yield improvement tool for the solder paste printing process. SPC+ Software, developed by Koh Young Technology, is a high-functionality statistical process control (SPC) package that can be run on the system or offline. The new software is included free of charge on all new Koh Young equipment.

The software offers the ability to analyze both images and data to track performance, improve manufacturing yields and provide complete traceability under real-time conditions. Defect review, X Bars & S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated quickly and accurately with Pareto charts and the ability to drill down on specific data points.

The real-time capabilities of SPC+ allow for immediate operator adjustment of solder paste printing parameters to achieve optimum print quality and eliminate defects before they occur, dramatically reducing repair costs.

For more information about the new SPC + Software, visit http://www.christopherweb.com

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Christopher Associates Accepts 2012 NPI Award for the MAGNUS HD TREND from Tagarno

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Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO

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Christopher Associates' Jasbir Bath to Present on Lead-free Alloys at IPC APEX 2012

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Christopher Associates to Unveil New SPI Unit at the 2012 IPC APEX Expo

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