FINETECH to Exhibit at ECTC 2010

May 24, 2010

FINEPLACER® Femto, a fully automated, sub-micron placement bonding platform.

FINEPLACER® Femto, a fully automated, sub-micron placement bonding platform.

FINETECH will exhibit in booth 403 at the Technology Corner of the Electronic Components and Technology Conference (ECTC), scheduled to take place June 2-3, 2010 at the Paris Las Vegas Hotel in Las Vegas.

Neil O’Brien, Director of Sales and Applications, and Robert Avila, Western Region Sales Manager, will be available to discuss the latest bonding technology solutions for 3-D integration, chip to wafer, MEMs, opto, advanced packaging, and 300 mm wafer support.

The company will have product literature available for its full range of bonders, including the FINEPLACER® Femto, a fully automated, sub-micron placement bonding platform as well as the FINEPLACER® Matrix, Finetech’s new semiautomatic bonder that supports wafer sizes up to 300 mm.

For more information, visit the company in booth 403 or visit

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia

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