Neil O’Brien, Director of Sales and Applications, and Robert Avila, Western Region Sales Manager, will be available to discuss the latest bonding technology solutions for 3-D integration, chip to wafer, MEMs, opto, advanced packaging, and 300 mm wafer support.
The company will have product literature available for its full range of bonders, including the FINEPLACER® Femto, a fully automated, sub-micron placement bonding platform as well as the FINEPLACER® Matrix, Finetech’s new semiautomatic bonder that supports wafer sizes up to 300 mm.
For more information, visit the company in booth 403 or visit http://www.finetechusa.com.
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia