SMT, PCB Electronics Industry News

Televés invests in innovative SIPLACE line

May 21, 2010

The Spanish company Televés S.A., a market leader in Radio and TV installation solutions, has been at the forefront of innovations since its foundation in 1958. One of Televés’ main success factors is the 25 years of close cooperation with Siemens Electronics Assembly Systems (SEAS). In order to be prepared for further innovations and growing product demands, Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA (Chip Assembly) machines. With the new SIPLACE line Televes acquired the potential to cover all future requirements with optimum flexibility combined with bare-die and classic component processing. “The key elements of our success are innovative products and production processes. With the new line we continue to secure our sustainability,” confirms Jorge Montero, Manufacturing Manager at Televés. The SIPLACE machines offer us the innovative potential and maximum flexibility needed in order to be successful for many years to come.”

Televés is a market leader in the area of self adjusting HD digital broadcast antenna elements. For these products the new SIPLACE CA delivers maximum performance and capability. With its four gantries the SIPLACE CA is prepared for both bare die placement which requires high accuracy, pick-up from wafer changer, dip fluxing etc., as well as for high speed placement of standard SMD components. In combination with an SIPLACE SX2 machine, equipped with the SIPLACE Multistar and SIPALCE Twinstar, this line enables Televés to cover the complete range of electronic components.

Up to 9,000 flip-chips per head per hour – directly from the wafer

The SIPLACE CA is based on the SIPLACE X-Series concept with additional SIPLACE wafer systems (SWS) as feeders. Other special features include a flip unit, special vision systems and a linear flux dip unit (LDU). When equipped with the SIPLACE Speedstar CP 20 head the SIPLACE CA is able to place up to 9,000 flip-chips or 6,000 die-attach components per hour in sizes ranging from 0.8 to 18.7 millimeters with an accuracy of ±10 µm. The SIPLACE wafer system can handle different wafers which are replaced automatically, and the punch-out speed is programmable.

Both Televés and SEAS have shared an extensive common history. The very first MS-72 placement machine from SEAS installed outside of Germany in 1984 went to Televés in Spain. The MS-72 is still held in honor on a podium in the Televés factory. “Over the years the SIPLACE machines have proved to be highly efficient allowing us to achieve the highest scores in reliability, performance and yield. When we began our evaluation process for our new line, the SIPLACE line was once again the line of choice by our evaluation team because of the equipment’s ability to combine bare-die and class component placement in a single line. We are very proud to once again be one of the first customers to acquire advanced technology machines like the SIPLACE CA and the SIPLACE SX 2. Our 25 year partnership with SEAS has proven to be highly beneficial in our efforts to continue our process innovation leadership position”.

Interested readers can find out more about the new SIPLACE CA machine at the SMT/HYBRID/PACKAGING trade show (Hall 7, Booth 204).

For more information about SIPLACE, visit

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