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Draper Chooses Universal's Versatile GenesisSC Platform

May 20, 2010

Draper Laboratory, Cambridge, Massachusetts – a research and development laboratory engaged in a broad array of programs for government and commercial sponsors – has selected Universal Instruments’ newly released GenesisSC Platform to be utilized in a wide range of assembly requirements. GenesisSC is a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform. GenesisSC is adaptable to virtually any production environment, delivering high performance across an array of applications.

Draper Laboratory employs more than 850 engineers, scientists, and technicians among its 1,384 employees. Its sponsored work encompasses capabilities in: Strategic Systems, Space Systems, Tactical Systems, Special Operations, Biomedical Engineering, Geospatial Solutions, and Energy Solutions. The Laboratory’s unparalleled expertise in the areas of guidance, navigation, and control systems remains its greatest resource. Draper is among the leaders in fault-tolerant computing, reliable software development, modeling and simulation, and MEMS technology. It applies its expertise to a broad range of domains, including autonomous air, land, sea, and space systems; information integration; distributed sensors and networks; precisionguided munitions; air traffic flow management; military logistics; and biomedical engineering and chemical/biological defense.

Because of the breadth of manufacturing requirements, Draper needed a solution that could address multiple needs. “For a seamless transition from one product to the next, we were looking for a solution that could be used for a variety of placement requirements,” comments Justin Medernach, Senior Member of the Draper Technical Staff. “GenesisSC offered that capability and more with flip chip, die attach, and standard surface mount capabilities down to 01005 passives on the same platform. This gave us the best value in terms of price and

capability. We also feel good about purchasing from the only remaining US-based equipment supplier.”

GenesisSC provides a sustainable solution with obsolescence protection for next-generation applications. Advanced peripherals, including the Linear Thin Film Applicator, provide cuttingedge capabilities for modern packaging challenges such as Package-on-Package (PoP). Heinz Dommel, Universal Marketing Director states, “We’re pleased to offer a class-leading semiconductor solution that is based on our Genesis Platform. It truly speaks to the power of the platform philosophy and the importance of leading-edge sub-system technologies to support the next wave of applications”. High-complexity products are no problem for GenesisSC, with accuracy down to ±10 micron – by far the highest accuracy of any standard SMT machine on the market. Additional features include NPI tools to further improve process efficiency in higher-mix environments, and traceability for piece of mind.

Draper’s lab environment will also benefit from the process expertise of Universal’s Advanced Process Lab (APL). The APL provides unique prototyping capability for leading-edge technologies, and boasts over 20 years experience in analyzing technology, process, substrate, and component trends. Further, the APL founded and leads the “Advanced Research in Electronic Assembly Consortia”, cooperating with industry partners to develop new methods and materials.

About Universal Instruments:

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, with offices in Europe, Asia, and the Americas.

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