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News from Vi TECHNOLOGY


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  • Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010

Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010

May 11, 2010

5K Series, a large board solution.

5K Series, a large board solution.

Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.

The 5K Series, a large board solution, offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connectors and passive components if 3D inspection of specific parameters is required. The innovative and modular concept of the 5K Series allows companies requiring entry-level or mid-range AOI systems to upgrade their equipment on-site to meet future requirements. Machines are equipped with PERFORM or PREMIUM P-Series heads, to offer greater versatility. The series has been designed with best-in-class hardware and software technologies to provide accuracy and repeatability and a short cycle time.

Vi TECHNOLOGY® Selective 3D technology paves the way to 3-dimensional AOI. This feature allows detection of coplanarity defects on surface mount components and makes multiple camera systems unnecessary. This option enables accurate, repeatable tilt and coplanarity measurements on ICs, connectors and passive components during PCBA inspection, without affecting cycle time. It is used for all applications, but mainly expensive, high-reliability end-user applications such as the Medical, Automotive, Industrial and Infrastructure market segments, where defects must be identified. The problem is that many of these defects remain invisible to electrical tests and require additional and costly process steps to eliminate them from the production line. Having this capability within the AOI enables significant savings and a fast return on investment. The Selective 3D AOI technology is available on new machines or as an upgrade for 3K and 5K platforms already in use.

Vision2009, the new integrated software suite, goes one step further in simplifying programming.

The new intuitive “Wizards” guide users through each step of program creation and optimization, reducing the need for advanced training. Vision2009 is based on Vi TECHNOLOGY’s modular software platform and accommodates all AOI application options including: 2D Post Print, Mixed Mode, Pre Reflow, Post Reflow, Post Wave, backplane inspection, OCV and OCR. The software suite also encompasses full offline programming capability, an optimization tool, centralized common database, cross platform program transportability, review/repair station, data mining system…

Vi TECHNOLOGY is a worldwide global supplier for the design, manufacture, and support of a wide range of innovative, Automated Optical Inspection (AOI) equipment and software solutions for a multitude of applications; including PCB assembly, back-end semiconductor production, incoming inspection and process control.

Our goal is to create value for customers by developing technologies which follow the evolution of our shared market. Our R&D program focuses on enhancing existing products as well as offering technological breakthroughs to achieve a sustainable level of excellence. With nearly 20 years' experience, our systems meet even the most demanding requirements in terms of accuracy, repeatability, speed, and quality. We are confirmed leaders in the AOI market and offer turnkey solutions to maximize Return-On-Investment, decreasing cost-of-ownership in manufacturing plants. Our equipment is supported by world-class service with a 24-hour hotline ensuring fast response times. We also have a strong network of 200 fully trained agents and distributors in America, Asia-Pacific and Europe-Africa, to ensure any issues are reported immediately to our offices.

Our many customers include the Number 1 player in the automotive electronics market, the Number 1 in the contract electronics manufacturer, and the Number 1 player in the mobile phone industry.

Our mission is to serve our customers worldwide to reach our Total Customer Satisfaction goals.

Further information on Vi TECHNOLOGY is available at http://www.vitechnology.com

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Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010 news release has been viewed 848 times

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  • Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010
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