SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


Apr 23, 2010

BANNOCKBURN, Ill., USA — Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC – Association Connecting Electronics Industries® announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at IPC APEX EXPO, held April 6–8, 2010 in Las Vegas.

Twenty–three industry posters were presented at this year’s show. The event’s Technical Program Committee selected the winners through a ballot process. Tied for first place honors were Christopher Hunt, Ph.D., National Physical Laboratory, for “Solder Joint Reliability from Material Properties,” and David Lee, Ph.D., Johns Hopkins University, for “Comparison of the Electrochemical and Physical Properties of the Nanocrystalline Copper Deposition in the Fabrication of Wiring Boards.”

“Every year, the quality and relevance of the industry posters further enhances the opportunities to gain new information at IPC APEX EXPO,” adds Greg Munie, IPC conference director.

In addition to the industry posters on display, IPC APEX EXPO held an academic poster competition. Ten posters highlighting research being conducted at the college level were featured from Auburn University; Missouri University of Science and Technology; Purdue University; University of California, Irvine; and University of Maryland. IPC APEX EXPO attendees voted on the top three posters, with first-place honors going to Pylin Sarobol, Aaron Pedigo, P.Su, J.E. Blendell, and C.A. Handwerker, Sc.D., from Purdue University for “A Defect Phase Diagram for Tin Whisker and Local Film Properties near Whiskers.” The same team, with Aaron Pedigo as the main author, took second place honors for “Tin Whisker Growth Related to the Crystallographic Texture of Sn and Sn Alloy Electrodeposits.” Amendra Koul from Missouri University of Science and Technology won third place for “Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor.”

Sponsored by the IPC Foundation, the academic competition was launched last year to promote greater accessibility to academic research and strengthen the relationship between academia and the industry worldwide. “IPC is delighted to offer this international venue to showcase the exciting work being done at universities all over the world,” said Kim Sterling, IPC vice president of marketing and communications. “Gaining this level of visibility can greatly accelerate the impact this research can have on the industry worldwide.”

IPC APEX EXPO 2011 will take place April 12–14 in Las Vegas. For more information on poster submission or if there is any other interest in participation in the 2011 IPC Shows, contact Greg Munie at, or Toya Richardson, IPC technical administrative assistant, at

About IPC

IPC ( is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Moscow, Russia; Stockholm, Sweden; and Shanghai and Shenzhen, China.

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