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DEK ProFlow ATx Tops Performance and Cost-Efficiency among Enclosed Head Print Systems

Apr 22, 2010

DEK's ProFlow® system is arguably the gold-standard for enclosed head printing technology. With nearly a decade of documented process advance under its belt, ProFlow has now evolved to deliver even greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.

With the ability to accommodate all solder pastes, ProFlow ATx provides the flexibility required by today’s demanding production environments. The technology combines a low-volume print chamber with an innovative paste loading mechanism, facilitating consistent process control and performance. Within the print chamber, ProFlow ATx’s conditioning grid actively conditions the solder paste materials and the system subsequently delivers a robust paste roll for precise aperture filling.

"Alternative enclosed systems do not actively condition the paste," says DEK's Andy Edmonds, Product Specialist. "The result of this inactivity is material separation and drying issues, which can lead to defective prints. ProFlow ATx eliminates this concern by incorporating active conditioning functionality."

ProFlow ATx’s direct, automatic loading from industry standard packaging assures that manual intervention is minimized and costs are reduced. Add to this the fact that materials are contained in a sealed environment, thus reducing waste, and ProFlow ATx is the clear solution for cost-efficient, environmentally responsible materials deposition.

Recent customer evaluations have confirmed the superior performance of ProFlow ATx. Tested against some aggressive targets, ProFlow ATx performed exceptionally well, meeting the criteria of first pass yield of better than 98% and scrap of less than 0.5%. The system also exceeded demanding material and cost savings metrics.

“The speed, throughput, cost efficiency, simplified cleaning and maintenance and operator ease of use afforded by ProFlow ATx are simply unmatched,” concludes Edmonds. “This technology delivers process efficiencies and performance levels other enclosed systems just can’t touch.”

About DEK

DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com.

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