“The Impact of Updates to J-STD-001” will be held May 17, 2010, in Irvine, Calif.; May 19 in San Jose, Calif.; October 12 in Boston and October 14 in Toronto. During the full-day workshop, attendees will be guided through the specific requirement changes impacting materials, hole-fill criteria, SMT termination styles, supplier flow-down, training for proficiency and rework, and compatibility with other IPC documents such as IPC-A-610E. The instructor, Teresa Rowe, is director of quality at AAI, Inc. and the leader of the IPC J-STD-001 Task Group. Rowe will provide insight into the reasons behind the changes. As part of the registration fee, a copy of the standard will be provided to each attendee.
Following each of the J-STD-001 workshops, full-day sessions covering changes to IPC-A-610 will be held. On May 18 in Irvine, Calif., and May 20 in San Jose, Calif., Constantino Gonzalez, president of ACME, Inc., and co-chair of the IPC-A-610 Task Group, will present “The Impact of Updates to IPC-A-610.” This workshop will cover the new criteria for SMT, mechanical assembly, depanelization, flex, and particulate matter as well as review new soldering connection requirements, process control indicators and component damage. Attendees will learn the target conditions for all three classes of production and how to easily assess acceptable and defect conditions. A copy of IPC-A-610E will be given to attendees. This workshop will also be held in Boston on October 13 and Toronto on October 15.
Focusing on the acceptability of printed boards and their qualification performance specifications, “The Impact of Updates to IPC-A-600 and IPC-6012,” will be held June 8 in Irvine, Calif., and June 10 in San Jose, Calif. The workshop will be led by Don Dupriest who is on the advanced manufacturing technology staff at Lockheed Martin Missiles and Fire Control. A member of the IPC Technical Activities Executive Committee and co-chair of the IPC Printed Board Storage and Handling Subcommittee, Dupriest will provide insight into the fabrication processes behind the updated requirements, engineering performance drivers and new requirements for thermal stress testing, copper cap plating for filled holes, copper wrap plating, etchback and dielectric removal, laminate anomalies, new surface finishes as well as the new supplemental requirements for space and military avionics, and much more. A copy of both standards will be provided to each attendee.
In addition to workshops focused on the updated standards, IPC will host “Lean in the Electronics Industry: Applying Theory to Practice,” on June 9, 2010 in Irvine, Calif. Taught by Kenny Heifner, vice president of operations and quality at SMS Technologies, Inc., the workshop will show attendees how to apply Lean theories into practice in an EMS situation. Also, “Lead-Free Assembly for High Yields and Reliability,” will be held on June 22 in San Jose, Calif. Workshop instructor Ronald Lasky, Ph.D., a senior technologist at Indium Corporation of America, will cover the reliability of different alloy systems, preferred printed board finishes, how to prevent process defects and the best practices for setting up an RoHS compliant process. He will also share the strategies of two successful process implementations.
Visit http://www.ipc.org/workshops-brochure for more information on these full-day workshops or to register. For information on the October events, e-mail PDfirstname.lastname@example.org. For a complete list of IPC events, visit http://www.ipc.org/events.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.